Thick Film Resistor Networks, Flat Pack

Features

• Isolatedand bussed schematics available0.065" (1.65 mm) height for high density packagingLow temperature coefficient (-55 °C to +125 °C) ± 100 ppm/°CHot solder dipped leadsHighly stable thick filmWide resistance rangeAll devices are capable of passing the MIL-STD-202, method 210, condition C “Resistance to Soldering Heat” test