Molded, 25 mil or 50 mil Pitch, Dual-In-Line Thin Film Resistor, Surface Mount Network

Features

• Reduces total assembly costs
• Compatible with automatic surface mounting equipment
• UL 94 V-0 flame resistant
• Thin film tantalum nitride on silicon
• Choice of package sizes: VTSR (TSSOP) JEDEC® MO-153, VSSR (SSOP or QSOP) JEDEC MO-137, VSOR (SOIC narrow) JEDEC MS-012
• Moisture sensitivity level 1 (per IPC/JEDEC STD-20C)
• Isolated/bussed/dual terminator/differential terminator circuits