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Thin Film Top-Contact Resistor with Part Mark image

Thin Film Top-Contact Resistor with Part Mark

Thin Film Top-Contact Resistor with Part Mark

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Product Details

Features

  • Wire bondable
  • Part marked - 5 digits
  • Small size: 0.022 inches square
  • Case: 0202
  • Resistance range: 1 Ω to 1 MΩ
  • DC power rating: 250 mW
  • Oxidized silicon substrate for good power dissipation
  • Resistor material: Tantalum nitride, self passivating
  • Moisture resistant

Applications

  • Vishay EFI SFP small resistor chips are widely used in hybrid packages where space is limited and chip value marking is important for identification. The die is part marked with the resistance value. Wire bonding is made to the two pads on the top of the chip.

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