Thick Film Resistor/Capacitor Networks, Dual-In-Line, Molded DIP

Features

• ECL terminator, ECL pull-down and thevenin equivalent terminator schematics available
• 0.190" (4.83 mm) maximum seated heightRugged molded case construction
• Thick film resistive elements
• Reduces total assembly cost
• Low temperature coefficient (-30 °C to +85 °C) ± 100 ppm/°C
• Compatible with automatic insertion equipment
• Reduces PC board space