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Thick Film Resistor Networks, Dual-In-Line, Molded DIP image

Thick Film Resistor Networks, Dual-In-Line, Molded DIP

Thick Film Resistor Networks, Dual-In-Line, Molded DIP

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Product Details

Features

  • TTL/ECLtranslater and SCSI-BUS signal terminator schematics available0.190" (4.83 mm) maximum seated heightRugged, molded case constructionLow temperature coefficient (-55 °C to +125 °C), MDP 1645: ± 100 ppm/°C, MDP 1646: ± 250 ppm/°CCompatible with automatic insertion equipmentThick film resistive elementsReduces PC board space and reduces total assembly costsAvailable in tube pack

Applications

  • TTLto ECL translator
  • TheMDP1645 network consists of 18 resistors of 3 different values, internally divided into six (6) identical three (3) resistor sections for TTL to ECL translation.
  • SCSI-BUSsignal terminator
  • TheMDP1646 network consists of 21 resistors of 2 different values, internally divided into seven (7) identical three (3) resistor sections for SCSI-BUS terminator applications.

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