Sandwich, 50 mil Pitch, Dual In-Line Thin Film Resistor, Surface Mount Network

Features

• Lead (Pb)-free gold plated terminals standard
• Gold-to-gold terminations. External leads are attached directly to gold pads on the ceramic substrate by thermo-compression bonding (no internal solder)
• Tighter tolerances than molded standards (0.01 %)
• Ceramic package with no cavity
• Flexibility of lead variations to save PC board space