Ceramic Sandwich, Single-In-Line Thin Film Resistor, Through Hole Network (Low Profile 0.20 Custom)

Features

• Gold-to-gold terminations. External leads are attached directly to gold pads on the ceramic substrate by thermo-compression bonding (no internal solder)
• Low profile (0.200 min.)
• Custom pin-outs available
• Compliant to RoHS Directive 2002/95/EC
• Halogen-free according to IEC 61249-2-21 definition