Wire Bondable Thin Film Micro-Strip Transmission Line Resistor Arrays
Wire Bondable Thin Film Micro-Strip Transmission Line Resistor Arrays
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Product Details
Features
- 50 Ω micro-strip configuration
- Wire bondable terminations
- Alumina (99.6 %) substrate; as-fired or polished
Applications
- Test and measurement setups
- Network analyzer calibration elements
- RF bread boarding
- High frequency hybrid assemblies
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